Diffusion
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Because of the Opti-Probe's exceptionally small spot size (0.9µ) and Beam Profile Ellipsometry (BPE) capability, thin gate oxides, tunnel oxides, native oxides, and residual oxides can now be measured to better than 0.1Å precision on product wafers with unsurpassed repeatability.
CMP
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As effective as Chemical Mechanical Polish (CMP) is for achieving planarityon complex, multi-layer wafers, it is a challenge to control.
The Opti-Probe has the features you need to control CMP. Simultaneous and independent measurement of multiple film layers eliminates under- and over-polishing. Small spot size lets you control polish rate and detect polish slopes on areas as small as 7µm x 7µm. Mapping, pattern recognition, and the ability to use a single recipe for all stacks make the job fast and easy.
CVD and PECVD
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Simultaneous and independent measurement of thickness and index is also key for films typically created by Chemical Vapor Deposition (CVD) and Plasma Enhanced CVD.
Opti-Probe can simultaneously measure 2 or 3 thicknesses and thus fully characterize these crucial film stacks. Even as total thickness approaches 100Å.
Etch
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Small spot size also comes into play during the etch process. It is the reason that only the Opti-Probe gives you full control of local etch sites.
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Opti-Probe: OP-2690
Available Measurement System Opti-Probe OP-2690 (Modified)
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Date of Availability Spring 2019
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For more Information Contact wharris@twavservice.com
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The Optiprobe is a specialized tool for measuring several different properties of specific films and multi-layer film stacks that are deposited or grown on wafers.
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Three robust measurement technologies working independently or together as a team to formulate the most accurate solutions for thickness, refractive index, and extinction coefficient.
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BPE- Beam Profile Ellipsometry provides the precise sensitivity necessary for the accurate measurement of film thickness of less than 100 angstroms (<10 nm).
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BPR- Beam Profile Reflectometry is the industry standard and reliably accurate measurement technology for most thicknesses above 100 angstroms with refractive indexes between 1.0 and 4.0. It is the ‘heart’ of every Opti-Probe measurement tool.
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VS- Visual Spectrometer uses wavelengths of spectral light to provide an excellent technology for measuring thick films with high refractive index. Excellent choice for rough film surfaces.
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All three technologies are non-destructive to the wafer being measured and therefore eliminate wafer scrap during this process step.
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Custom manual measurements on specific die accommodates measurement of ASICs devices
Lithography: Optimizing resist exposure time; characterizing anti-reflective coatings; determining the thickness of the resist layer without exposing it.
Etch: Determining how much material has been removed AND the rate of removal.
Dielectrics and Diffusion: t,n,k measurements and rates of deposition.
0.9 micron spot size accommodates even microscopic measurement sites.